High Bandwidth Flash (HBF) memory
The first HBF specification was published in early August 2026, and first memory samples are targeted for the second half of 2026.
What it is
A stacked flash memory product for AI inference, developed with SK hynix. The specification covers stacks up to 512 GB with three bandwidth grades, from roughly 0.4 TB/s to 3.0 TB/s, connected over UCIe.
Why it matters to the stock. HBF would open an AI memory market beyond data-center SSDs. Sandisk has not yet given a volume production date, so this is a long-dated option rather than a near-term earnings driver.
News
Sandisk and SK hynix publish first High Bandwidth Flash specification through OCP
Sandisk and SK hynix released the first open specification for High Bandwidth Flash (HBF), a stacked NAND memory product aimed at AI inference.
Sandisk and SK hynix start global standardization of High Bandwidth Flash
On February 25, 2026 Sandisk and SK hynix announced a joint standardization workstream for High Bandwidth Flash (HBF), a stacked NAND product aimed at AI inference.