Besi joins Applied Materials' EPIC Center as innovation partner in an expanded packaging partnership

Applied Materials and BE Semiconductor Industries (Besi) expanded their partnership, and Besi joined Applied's EPIC Center in Silicon Valley as an innovation partner. The work now reaches past die-to-wafer hybrid bonding into new interconnect architectures, 3D chip scaling and logic and memory integration for AI. AMAT rose about 2.5% in the afternoon session and traded near $523 after easing.

• Besi joins the EPIC Center as an innovation partner
• Scope extends past die-to-wafer hybrid bonding
• AMAT up about 2.5% intraday, around $522.95
• Builds on the earlier Kinex hybrid bonding work with Besi