Lam opens Panel-Level Packaging Center of Excellence in Salzburg, Austria

Lam opened its Panel-Level Packaging Center of Excellence in Salzburg, which it calls its first panel-focused wet processing R&D site. The centre works on wet-chemical processing for square and rectangular substrates and extends Lam's plating, clean and etch expertise from round wafers to panels. The site builds on Semsysco, which Lam bought in 2022, and the release gives no investment or capacity figures.

• Announced May 20, 2026 in Salzburg, Austria
• First Lam R&D site focused on panel-level wet processing
• Extends plating, clean and etch from wafers to panels
• Builds on Semsysco GmbH, founded in 2012 and acquired by Lam in 2022