TSMC board approves US$29.4B capital appropriation, NT$7.0 Q2 dividend and Sony image-sensor JV

At its August 11 board meeting TSMC approved capital appropriations of about US$29.44 billion for advanced nodes, advanced packaging, mature and specialty capacity, and fab construction. It kept the cash dividend at NT$7.0 per share for Q2 2026, with an ex-dividend date of December 10, 2026 and payment on January 7, 2027. The board also approved a joint venture with Sony Semiconductor Solutions for next-generation image sensors, with TSMC subscribing up to 282 billion yen.

• Capital appropriations of about US$29,442.5M approved
• Cash dividend NT$7.0 per share for Q2 2026, flat on the prior quarter
• Ex-dividend December 10, 2026; record December 16, 2026; payment January 7, 2027
• New Sony Semiconductor Solutions JV for image sensors; TSMC subscription up to JPY 282B