Sub-1nm logic scaling with IBM
A five-year joint research programme with IBM, signed in March 2026, has no commercial timeline or disclosed customers.
What it is
A joint research effort to develop new materials, etch and deposition processes, and High-NA EUV lithography for logic chips below 1 nanometre. The work runs at IBM's NY Creates Albany NanoTech Complex, where Lam supplies process tools. The companies have not named any chipmaking partner or a production date.
Why it matters to the stock. Equipment makers that help define a node early tend to keep the first production orders for later generations. The programme is a long-dated option, not a near-term revenue driver.
News
IBM and Lam Research sign five-year collaboration on sub-1nm logic scaling
IBM and Lam announced a five-year agreement to develop materials and processes for logic chips below 1 nanometre.