Applied unveils Centris Spectral SiN ALD and Producer Selectra Mo Etch for 3D chip scaling

Applied launched two tools for 3D chip structures: Centris Spectral SiN ALD, which deposits silicon nitride in tall, narrow features using microwave plasma, and Producer Selectra Mo Etch, which selectively removes molybdenum to separate 3D NAND wordlines. Applied says leading chipmakers are adopting the systems and that the etch tool is already validated in high-volume manufacturing. Those performance and adoption claims come from the company and have not been independently verified.

• Centris Spectral SiN ALD: silicon nitride deposition in 3D structures
• Producer Selectra Mo Etch: molybdenum wordline separation in 3D NAND
• Applied says the etch tool is validated in high-volume manufacturing
• Performance claims are company-reported