Applied introduces six DRAM and advanced-packaging systems aimed at HBM and hybrid bonding

Applied launched six systems for DRAM and advanced packaging, including Centura Prime Epi for DRAM peripheral transistors and Producer Avila 2 PECVD for HBM and thin DRAM dies. Packaging tools include Opta Quad CMP for hybrid bonding, Nokota VMax 2 ECD for copper plating of through-silicon vias and microbumps, and two electron-beam systems, VeritySEM 7AP metrology and SEMVision G7AP defect analysis. Applied says Centura Prime Epi occupies 20% less fab floor space than previous generations, and that SEMVision G7AP is already deployed in production.

• Centura Prime Epi: DRAM peripheral transistors, 20% less floor space claimed
• Producer Avila 2 PECVD: HBM and thin DRAM dies for 12-, 16-layer and taller stacks
• Opta Quad CMP: advanced packaging for hybrid bonding
• Nokota VMax 2 ECD: copper plating for TSVs and microbumps
• VeritySEM 7AP and SEMVision G7AP: electron-beam metrology and defect analysis