HBM advanced packaging (Singapore)
Expanded advanced packaging capacity for HBM is expected to begin in early calendar 2027.
The numbers
Expanded advanced packaging capacitybegins in early calendar 2027 (expected)as of fiscal 2026 10-K · source ↗
What it is
A new high-bandwidth memory advanced packaging facility in Singapore, where groundbreaking took place in January 2025. Micron also plans HBM packaging in the US.
Why it matters to the stock. Packaging is a bottleneck for HBM output alongside DRAM wafers. The timing of new packaging capacity limits how fast HBM can grow in 2027.
News
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