Qualcomm, Lumentum and Corning to demo optical die-to-die link for AI scale-up

Qualcomm, Lumentum and Corning said they will demonstrate a high-density optical die-to-die interconnect for AI scale-up systems at ECOC 2026 in Malaga, Spain. Qualcomm supplies the die-to-die interface IP, Lumentum the 1060 nm VCSEL optical engine and Corning the multimode fiber connectivity. The aim is high-bandwidth links for future co-packaged and near-packaged optics. This is a technology demonstration, not a product order.

• Lumentum optical engine with about 10 Tb/s aggregate transmit and receive capacity
• Proof of concept uses 32 Gb/s NRZ optical channels
• About 1 Tb/s/mm shoreline density today, with a target of about 4 Tb/s/mm
• Demonstration at ECOC 2026 in Malaga, Spain