SK hynix 2026 Future Forum sets out full-stack AI memory strategy

At its 2026 Future Forum on September 8 at the Icheon campus, SK hynix said it wants to move beyond selling memory devices and become a full-stack AI memory creator that co-designs systems with partners. The plan combines 3D stacked DRAM, HBM and high-bandwidth flash, matched to each AI workload, with tiered memory from HBM down to SSDs. The forum gave no financial targets or capacity figures, so it is a strategy signal rather than a numbers event.

• Forum held September 8, 2026, at Icheon
• Strategy: full-stack AI memory creator
• Memory tiers: HBM, DRAM, CXL, SSD and new tiers
• No financial or capacity figures disclosed