SK hynix and SanDisk release first high-bandwidth flash (HBF) standard specification

SK hynix and SanDisk released the first HBF specification at the Future of Memory and Storage 2026 conference in Santa Clara on August 4, 2026, publishing it through the Open Compute Project. HBF sits between HBM and SSDs and is meant to add memory capacity for AI accelerators. The release gave no commercial volumes or prices.

• Capacity up to 512GB per device with 8- or 16-high NAND stacks
• Three bandwidth grades, from about 0.4 TB/s to 3 TB/s
• Uses the industry-standard UCIe chiplet interface
• Google and Tenstorrent named as consortium participants