Advanced packaging (CoWoS, InFO, SoIC, COUPE)
Packaging capacity 'so tight' it limits customer growth (2Q26 call); no capacity figure given
What it is
Advanced packaging joins several chips into one package. CoWoS is the main route for AI accelerators with stacked memory. SoIC is 3D chip stacking, and COUPE is a compact photonic engine for large-scale interconnect. On the 2Q26 call, TSMC added a glass-substrate pilot line that management said is about a year from maturity.
Why it matters to the stock. Packaging capacity is often the bottleneck for AI accelerators, so CoWoS capacity news moves the AI supply chain as much as wafer news does. Management welcomed alternative packaging options, which is a sign that demand is ahead of CoWoS supply.
News
TSMC unveils A13, A12 and N2U roadmap at North America Technology Symposium
At its North America Technology Symposium in Santa Clara on April 22, TSMC announced A13, an optical shrink of A14 with about 6% smaller area, and A12, an A14-based node with Super Power Rail backside power.
TSMC unveils A13, A12 and N2U process roadmap at North America Technology Symposium
At its North America Technology Symposium in Santa Clara on April 22, 2026, TSMC introduced A13, which it says gives 6% area savings over A14 and enters production in 2029.